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A report published by SEMI, a global industry association representing electronics design and manufacturing companies, predicts a 14% increase in global fabrication capacity for 200-millimeter wafers over the next three years. This growth is attributed to the rising demand for semiconductor chips, especially those used in electric vehicles (EVs). The report, titled 200mm Fab Outlook to 2026, highlights the development of powertrain inverters and charging stations for EVs as a key driver for the expansion of global 200mm wafer capacity. The semiconductor industry is witnessing a ramp-up in 200mm fab capacity, particularly in response to bullish expectations for growth in the automotive market. While automotive chip supply has stabilized, the increased chip content in EVs and the push to reduce charging time are driving capacity expansions. SEMI President and CEO Ajit Manocha noted that fab capacity for automotive and power semiconductors is expected to grow by 34% by 2026, followed by microprocessor and microcontroller units at 21% and micro-electromechanical systems at 16%. Semiconductor manufacturers such as Bosch, Fuji Electric, Infineon, and Mitsubishi are all scaling up their 200mm capacity projects to meet future demand. 200mm wafers, also known as 8-inch wafers, have experienced renewed demand, particularly for analog, display drivers, and power management ICs, which are produced in 200mm fabs. Despite being considered outdated compared to larger wafers like 300mm, the 200mm market rebounded in 2020 due to increased demand for these specific chip types.
