Intro: The technology uses a thin layer of water between the projection lens and silicon wafer, enabling finer circuit patterns than conventional dry lithography systems.
Singapore
China has started mass production of domestically developed immersion deep-ultraviolet (DUV) lithography machines, marking a significant milestone in its drive to reduce reliance on foreign semiconductor technology, according to a source familiar with the matter.
The production effort is being led by Shanghai Aishengna Electronic Technology Group, a little-known state-owned company established in 2023. The company has reportedly brought together engineering teams from leading Chinese lithography firms, including Shanghai Micro Electronics Equipment (SMEE) and Yuliangsheng, to accelerate indigenous chipmaking equipment development.
Immersion DUV lithography machines are essential for manufacturing a wide range of advanced semiconductor chips. Although less advanced than extreme ultraviolet (EUV) systems, immersion DUV tools can produce sophisticated chips using multiple-patterning techniques.
The development is viewed as an important step in Beijing’s semiconductor self-sufficiency strategy, one of President Xi Jinping’s key industrial priorities. However, industry experts say the Chinese-made machines are still undergoing testing and remain well behind the performance and reliability of comparable systems produced by Dutch chip equipment giant ASML, the global leader in lithography technology.
Aishengna plans to manufacture around five DUV machines this year and increase production to about 20 units in 2027. The first systems are expected to be delivered to major Chinese chipmakers, including Semiconductor Manufacturing International Corp (SMIC), Hua Hong Semiconductor, and memory-chip producer ChangXin Memory Technologies (CXMT).
The launch comes amid tightening US and Dutch export controls that have restricted China’s access to advanced lithography equipment, particularly ASML’s EUV systems and certain high-end DUV machines. The locally developed tools could provide Chinese manufacturers with an alternative source of critical equipment if further sanctions limit imports or maintenance support for foreign machines.
Despite the announcement, analysts believe the move is unlikely to pose an immediate commercial challenge to ASML. They note that producing a limited number of prototype machines is far different from manufacturing highly reliable systems capable of supporting large-scale commercial semiconductor production, where precision, throughput, yield and long-term reliability remain crucial.
BOX
China drives chip equipment
Shanghai Aishengna leads a state-backed initiative, uniting elite engineers from SMEE and Yuliangsheng. This collaboration aims to accelerate indigenous immersion DUV lithography development, essential tools enabling China to manufacture sophisticated advanced semiconductor chips using innovative multiple-patterning techniques.
Beijing’s domestic DUV chip machines
- Aishengna targets twenty 2027 units.
- Machines currently undergo strict testing.
- Performance trails ASML industry standards.
- SMIC and CXMT receive systems.
- Sanctions drive local semiconductor independence.